T-Chip Group
Intelligent hardware website
Innovate intelligent hardware and solutions.
Server Business Website
Server products and efficient solutions.
Consumer Business Website
StationPC NAS products and services.

AIBOX PRO Edge Computing Box

M.2 Interface for AI Module Expansion

· Dual-Core Design for Multi-Task Processing

· Primary Module 8K Codec, Multi-Channel 4K Processing

· High-Compute Modules for Multi-Scenario Needs

· Millisecond-Level Low Latency 

· Onboard PCIe Interface for Storage Expansion

· Full Aluminum Alloy Shell

· Rich Expansion Interfaces

· Provides Development Materials

Manual Wiki Download

AI Agent

VLM/ALM

AIoT

AIBOX PRO
AIBOX PRO Edge Computing Box

AIBOX PRO is a compact host designed for edge large model deployment. It supports LLM, VLM, AI Agent, and multimodal large model implementation, while also remaining compatible with traditional algorithms such as CNN and RNN. The device adopts a heterogeneous modular architecture featuring a main controller plus an independent AI coprocessor, both designed as modules. This allows flexible selection of modules with different computing power and memory specifications based on application requirements. The device integrates CAN-FD and RS485 industrial interfaces, making it suitable for both general AI and industrial intelligence deployment needs.

Dual-Core Architecture

Heterogeneous primary + secondary modular architecture connected via PCIe. Primary module: task scheduling & data preprocessing. Secondary module: core AI inference, model parallelism, multi-task coordination. Ideal for robot navigation and multimodal perception — efficient resource allocation, low latency, stable operation for complex tasks.

Primary Module 8K Codec support

Primary module integrates a high-performance VPU — 8K hardware encode/decode, plus hardware-accelerated scaling and cropping. Handles multi-channel 4K video streams in parallel for efficient edge video preprocessing. Flexible hardware, storage, and OS options for AI inference runtime. Rich I/O interfaces for HMI, data acquisition, and real-time control — expanding application possibilities.

High-Compute Modules for Needs

The secondary module supports high-compute, high-bandwidth modules such as RK1828 and HOUMO LQ50, providing powerful computing foundation for scenarios including LLMs, VLMs, MoE models and AI Agents. Its compute-in-memory architecture significantly increases DRAM bandwidth, improving LLM inference TPS and time-to-first-token performance. Future upgrades will support RK1860.

Millisecond-Level Low Latency

With local AI processing, network dependency is minimized — no need to upload data to the cloud, and operations are unaffected by network bandwidth or speed fluctuations, enabling millisecond-level response and data privacy protection. All business data is stored and processed locally, meeting data security regulations and industry privacy compliance requirements.

Onboard PCIe Interface for Storage

Onboard M.2 PCIe high-speed interface supports NVMe SSD expansion. Optional high-speed SSDs can be added to easily expand total system storage to terabyte level, meeting local storage requirements for large model packages and massive business data.

Full Aluminum Alloy Shell

Equipped with an industrial-grade full aluminum alloy enclosure and an active cooling fan for efficient heat dissipation. Supports 24/7 uninterrupted stable operation, maintaining excellent computing performance and system stability even under high-temperature conditions — fully adaptable to the needs of various industrial scenarios.

Rich Expansion Interfaces

Offers a variety of interfaces including dual Gigabit Ethernet, USB 3.0, HDMI, NVMe, 4G/5G, RS485, CAN-FD, and opto-isolated DI/DO, flexibly adapting to various industrial peripherals and industry application expansions.

Provides Development Materials

Provides accompanying source code, tutorials, technical documentation, and development tools, making development easier and more convenient.
M.2 Interface for Diverse AI Module Expansion

Adopts heterogeneous modular architecture featuring a main controller + independent AI coprocessor. The main controller is compatible with flagship SoCs including Rockchip RK3588, SpacemiT K3, and Qualcomm QCS8550. Dual M.2 slots can accommodate two accelerator cards simultaneously, supporting modules such as Rockchip RK1828, HOUMO LQ50, and DeepX DX-M1, enabling capacity expansion without hardware modification. Equipped with network ports, video storage, as well as industrial interfaces including RS485, CAN-FD and opto-isolated DI/DO, it is well-suited for industrial deployments across various sectors.

Application Scenarios

Widely applicable in industries such as robotics, AI edge computing, industrial automation, intelligent security, autonomous driving, smart cities, traffic management, home storage, and retail automation.

Robots
Robots
Edge Computing
Edge Computing
Industrial Automation
Industrial Automation
Intelligent Security
Intelligent Security
Smart City
Smart City
Traffic Management
Traffic Management
Interfaces
Specifications

AIBOX PRO

Basic Specifications

Host module

RK3588 module (Core-3588JD4): LPDDR4/LPDDR4x (4/8/16/32GB) + eMMC (32/64/128/256GB), 6TOPS(INT8)

Video encoding

RK3588: 8K@30fps H.264

Video decoding

RK3588: 8K@60fps VP9/AVS2, 8K@30fps H.264 AVC/MVC, 4K@60fps AV1, 1080P@60fps MPEG-2/-1/VC-1/VP8

Accelerator expansion (Slave module)

2 × M.2 M-KEY (Supports 2260/2280 accelerator cards & other M.2 modules, inside the device) * Users can install any brand M.2 M-KEY accelerators; standard equipped with RK1820/RK1828 modules ○ RK1820: Onboard 2.5GB DRAM, 20TOPS(INT8), runs LLMs up to 3B smoothly ○ RK1828: Onboard 5GB DRAM, 20TOPS(INT8), runs LLMs up to 7B smoothly

Storage expansion

1 × M.2 M-KEY (Expandable with PCIe4.0 x4 NVMe 2280 SSD, inside the device) 1 × SATA3.0 (Expandable with SATA3.0 SSD, inside the device, not populated by default) 1 × TF Card

Device power

DC 12V/5A(5.5×2.1mm, support 9V~36V wide voltage input)

Accelerator power

2 × 12V (2pcs 4Pin-1.25mm wafer sockets)

OS

Linux

Dimension

160mm × 111mm × 61mm

Environment

Operating Temperature: -20℃～60℃, Storage Temperature: -20℃～70℃, Storage Humidity: 10%~90%RH (non-condensing)

Interface Specifications

Network

2 × Gigabit Ethernet (1000Mbps/RJ45) Wi-Fi & Bluetooth: Support dual-band 2.4GHz/5GHz Wi-Fi and Bluetooth 5.2 (Expandable via M.2 E-KEY inside the device) 4G/5G: Expandable via Mini PCIe inside the device

Video output

1 × HDMI2.1 (Up to 4K@60Hz)

Audio

1 × Line In (3.5mm audio jack), 1 × Line Out (3.5mm audio jack)

USB

2 × USB3.0 (Max: 1A), 1 × Type-C (USB2.0 OTG), 1 × Type-C (Debug)

Button

1 × Power key, 1 × Upgrade key

Antenna

2 × Wi-Fi Antenna, 1 × 4G Antenna, 4 × 5G Antenna

Others

1 × SIM Card
Accessories

4G Module Kit- EG25-G

$ 39.00

WXT14R2201 WiFi Module

$ 15.00

FORESEE M.2 2280 SSD

$ 79.00

Go to more product
Customization

Firefly team, with over 20 years of experience in product design, research and development, and production, provides you with services such as hardware, software, complete machine customization, and OEM server.

Hardware Solution

Software Solution

Turnkey Solution