· AI Processor QCS8550
· Deployment of Large AI Models
· Multiple Deep Learning Frameworks
· Supports Ray Tracing Technology
· 8K Video Encoding and Decoding
· Qualcomm Cognitive ISP with 36MP Triple Camera
· Rich Expansion Interfaces
· Comprehensive Development Toolchain
Qwen
Gemma
Llama
DeepSeek
Equipped with the Qualcomm QCS8550 octa-core AI processor with a 48 TOPS NPU, it supports mainstream AI models and frameworks. It also features an Adreno 740 GPU for ray tracing and 8K video, three cognitive ISPs for up to 100MP cameras, and various expand ports. Technical support like AI optimization tools and reference designs enable efficient development.
AI Processor QCS8550
Private Deployment
Deep Learning Frameworks
Ray Tracing Technology
Suppurt 8K Video Codec
36MP Triple Camera
Rich Expansion Interfaces
Development Toolchain
Integrated 48 TOPS NPU supports mixed-precision computation (INT4 to FP16), enabling powerful edge AI capabilities such as intelligent data processing, voice recognition, and image analysis for most terminal devices.
It is widely applicable across various industries and fields, including robotics, drones, cameras, edge computing, cloud gaming, computing services, intelligent security, and smart homes.

AIO-8550JD4 |
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Basic Specifications |
SOC |
Qualcomm QCS8550 |
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CPU |
Qualcomm Kryo® CPU: Octa-core 64-bit (1×GoldPlus@3.2GHz + (2+2)Gold@2.8GHz + 3×Silver@2.0GHz), 4nm advanced process, maximum frequency up to 3.36GHz |
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GPU |
Adreno 740 GPU: Supports ray tracing technology, OpenGL ES 3.2, Vulkan 1.2, full-profile OpenCL 3.0, and Adreno NN Direct |
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ISP |
Equipped with Qualcomm Spectra Cognitive ISP (Image Signal Processor), featuring three 18-bit 36MP ISPs |
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NPU |
Dual eNPU V3: Equipped with 4 HVX (Hexagon Vector Extensions), 1 HMX (Hexagon Matrix Extension); Computing power up to 48 TOPS (INT8), 12 TOPS (FP16) |
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Codec |
Video decoding: 8K@60fps/4K@240fps H.264/VP9/AV1 Video encoding: 8K@30fps/4K@120fps H.264 Supports concurrent 4K@60fps decoding and 4K@60fps encoding for wireless display scenarios |
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RAM |
16GB LPDDR5x |
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Storage |
256GB UFS4.0 |
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Storage expansion |
1 × M.2 M-KEY (supports expansion of SATA 3.0/PCIe NVMe SSD, compatible with 2242/2260/2280 form factors), 1 × TF Card |
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Power |
DC 12V (5.5mm × 2.1mm,support 12V~24V wide voltage input) |
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Power consumption |
Normal: 4.8W(12V/400mA), Max: 18W(12V/1500mA) |
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OS |
Linux |
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Software support |
Supports on-premises deployment of large-scale parameter models based on the Transformer architecture, such as large language models (LLMs) including the Deepseek-R1 series, Gemma series, Llama series, Qwen series, Phi series, etc. Supports the QNN AI inference framework, as well as various deep learning frameworks including TensorFlow, TensorFlow Lite, PyTorch, ONNX, etc. |
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Size |
122.89mm × 85.04mm × 31.55mm |
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Weight |
Without heatsink: 117g; With heatsink: 165g |
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Environment |
Operating Temperature: -20℃~60℃, Storage Temperature: -20℃~70℃, Operating Humidity: 10%~90%RH (No condensation) |
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Interface Specifications |
Network |
Ethernet: 2 × RJ45(1000Mbps) WiFi: Extend WiFi/Bluetooth module through M.2 E-KEY (2230), supporting 2.4GHz/5GHz dual band WiFi6 (802.11a/b/g/n/ac/ ax) and Bluetooth 5.2 4G: Extend 4G LTE via Mini PCIe (Shared with 5G) 5G: Extend 5G via M.2 B-KEY (Shared with 4G, not mounted by default) |
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Video input |
2 × MIPI D/C PHY (4 lanes DPHY or 3 trios CPHY) + 2 × MIPI D/C PHY (2 lanes DPHY or 1 trio CPHY) |
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Video output |
1 × HDMI2.0 (4K@60Hz) |
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Audio |
1 × 3.5mm Audio jack (Supports MIC recording, American standard CTIA) |
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USB |
2 × USB3.0 (Max: 1A), 1 × Type-C (Flash) |
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DIP switch |
1 × Auto Power-on DIP Switch (ON: Power on directly when connected; 1(OFF): Press Power button briefly to power on after connection) 1 × Type-C function selection(ON: Debug; 1(OFF): Flash) |
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Button |
1 × Reset, 1 × Recovery, 1 × Power |
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Other interfaces |
1 × FAN (4Pin-1.25mm), 1 × SIM Card 1 × Double-row pin headers (20Pin-2.0mm): USB2.0, UART, 2 × I2C, Line in, Line out, GPIO 1 × Phoenix connector (8Pin-3.5mm): 1 × RS485, 1 × RS232, 1 × CAN 2.0 |
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