iCore-3562Q is powered by the Rockchip RK3562, a quad-core 64-bit Cortex-A53 processor with a frequency of 2.0
GHz, delivering 1 TOPS (INT8)
of computing power. It supports deep learning frameworks and features up to 8 GB of RAM. The BTB interface
provides more powerful
transmission. This core board supports various video output options, multiple cameras, Gigabit Ethernet, WiFi,
and 5G/4G expansion.
With support for multiple operating systems, it meets diverse application requirements.
Designed for industrial-grade electronic devices, the RK3562 is a high-performance, low-power quad-core 64-bit
Cortex-A53 application
processor with up to 2.0 GHz. It offers compatibility with Open GL ES 1.1 / 2.0 / 3.2, Open CL 2.0, and Vulkan
1.1, and comes equipped
with high-performance 2D acceleration hardware. This processor provides a 13-megapixel ISP with HDR support. The
RK3562 is built
for wide-temperature resilience, reliably operating from -20°C to 60°C, making it ideal for a variety of
applications.
This core board supports 4K@30fps H.265/H.264/VP9 and 1080P@60fps H.264 video decoding, as well as 1080P@60fps
H.264 video
encoding. It provides video output interfaces including MIPI-DSI (2048 * 1080@60fps), single-channel LVDS (800 *
1280@60fps),
and RGB (2048 * 1080@60fps). Support MIPI-CSI interface configurations (2 * 4 lanes, or 4 * 2 lanes, or 1 * 4
lanes + 2 * 2 lanes).
With PCIe / GMAC / SDIO 3.0 / USB 3.0, it can be extended to multi-channel Gigabit Ethernet,
WiFi 6, Bluetooth, and 5G/4G LTE, enabling higher-speed network communication.
The core board uses a BTB package, ensuring a tight and secure connection. This design facilitates
easier attachment to a backplane and offers high reliability and stability.
With PCIe 2.1, USB 3.0, USB 2.0, UART, CAN, I2C, I2S, SPI, PWM, ADC, and SDIO, it meets the
requirements for data acquisition and transmission applications.
Equipped with a new-gen high-performance processor, precision components, and connectors, this device ensures
uninterrupted,
stable operation 24/7 in temperatures ranging from -20°C to 60°C, meeting the needs for diverse industrial
application scenarios.
Support Linux OS (Ubuntu and Debian) and Buildroot+QT. Operating systems are secure and reliable to meet different needs.
We provide a backplane reference design and technical information. So users can efficiently continue
their secondary development and quickly launch independent and controllable products.
We offer SDKs, tutorials, technical documentation, and development tools to streamline and improve the development process.
The core board can be widely used in intelligent digital signage, industrial control systems, industrial PLCs,
energy data concentrators, smart healthcare, self-service terminals, and more.
iCore-3562Q (Commercial) | iCore-3562JQ (Industrial) | ||
Basic Specifications | SOC |
Rockchip RK3562 |
Rockchip RK3562J |
CPU |
Quad-core 64-bit Cortex-A53 processor, up to 2.0GHz |
Quad-core 64-bit Cortex-A53 processor; Normal mode: 1.2GHz; Overclocking mode: 1.8GHz |
|
NPU |
Up to 1 TOPS (INT8), supporting INT4/INT8/INT16/FP16, Support deep learning frameworks including TensorFlow/PyTorch/Caffe/MXNet |
None |
|
GPU |
ARM G52 2EE, supporting OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1 A built-in high-performance 2D acceleration hardware |
||
ISP |
13M ISP with support for HDR |
||
VPU |
Video decoding: 4K@30fps H.265/VP9, 1080P 60fps H.264 Video encoding: 1080P 60fps H.264 |
||
RAM |
LPDDR4 (2GB/4GB/8GB optional) |
||
Storage |
eMMC (16GB/32GB/64GB/128GB optional) |
||
Power |
5.0V (voltage tolerance ± 5%) |
||
OS |
Ubuntu、Debian、Buildroot+QT |
||
Size |
59.99mm * 36.02mm * 5.80mm |
||
Weight |
≈12g |
||
Dimension |
BTB connector (3 * 80 PIN, 0.5mm pitch) |
||
PCB Specification |
1.6mm thickness, 6-layer PCB, high Tg material, immersion gold process |
||
Interfaces | Environment |
Operating temperature: -20℃- 60℃ Storage humidity: 10%~90%RH (non-condensing) |
Operating temperature: -40℃- 85℃ Storage humidity: 10%~90%RH (non-condensing) |
Network |
One RMII for 100 Mbps Ethernet expansion; one RGMII for Gigabit Ethernet (1000 Mbps) expansion, supporting dual IP for WAN and LAN ports. “WiFi + BT” module expansion available via SDIO. |
||
Video Input |
2 * MIPI CSI (4 lanes) or 4 * MIPI CSI (2 lanes) or 1 * MIPI CSI (4 lanes) + 2 * MIPI CSI (2 lanes) |
||
Video Output |
LVDS/ MIPI-DSI (LVDS supports 800*1280@60Hz; MIPI-DSI supports 2048*1080@60Hz) RGB (2048*1080@60Hz) |
||
Audio Output |
1 * SPDIF, 1 * PDM (8 lanes), 2 * DAC (I2S/PCM) |
||
USB |
1 * USB 3.0 OTG (shared with PCIe 2.1), 2 * USB 2.0 HOST |
||
PCIe |
1 * PCIe 2.1 (1 lane, shared with USB 3.0) |
||
CAN |
None |
2*CAN, supporting CAN2.0B, a data rate of 1 Mbps |
|
Other |
10 * UART、3 * SPI、13 * ADC、16 * PWM、1 * SDMMC、GPIOs |
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