Core-3399KJ Overview Specifications Wiki Technical Case Download
Core-3399J Overview Specifications Wiki Technical Case Download
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Core-3399KJ Core-3399J

Core-3399KJ 6-Core 64-Bit High-Performance Core Board

Powered by RK3399K 6-core 64-bit processor with integrated quad-core Mali-T860 GPU, it has high frequency up to 2.0GHz, supporting long and stable operation over a wide temperature range from -20°C to 70°C and having various of interfaces. With stable and reliable performance, it can be widely used in industrial equipment.

  • Strong Performance

    Six-Core-64-Bit 2.0GHz
    processor

  • High Reliability

    Immersion gold process,
    7x24 hours stable operation

  • High Scalability

    Rich interface,can
    drive mainstream screen

  • Support Multiple OS

    Android/Ubuntu/Linux

  • Open Source

    Open source SDK
    and provide docs

Compact and Beautiful

The design size is only 82mm x 63mm, you can save more precious space.

Immersion Gold Interface,
Solid and Reliable

With MXM3.0-314P interface, data transmission and expansion performance have been the best play,Immersion gold process pins corrosion-resistant,4 Stud fixed,solid and reliable.

Open Source

Complete with SDK, tutorial, technical information and development tools can be downloaded on the website, and provide development base plate for purchase, development and learning becomes easier.

AIO-3399J MainBoard

Core-3399J

Application

Core-3399J can be applied to products of various industries only by expanding the functional base plate.

  • Computing/

    Storage

  • Computer Vision

  • Game Equipment

  • Commercial Display

  • Medical Equipment

  • Vending Machine

  • Intelligent POS

  • Interactive Printer

Specifications

Core-3399J (Commercial) Core-3399KJ (Industrial)
Basic Specifications CPU

RK3399

Hexa-core 64-bit (Cortex-A72×2 + Cortex-A53×4) processor,

up to 1.8 GHz

RK3399K

Hexa-core 64-bit (Cortex-A72×2 + Cortex-A53×4) processor,

up to 2.0 GHz

GPU

Mali-T860 MP4 quad-core GPU, Support OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11

Support AFBC (Frame Buffer Compression)
ISP

Built-in dual hardware ISP, Support up to single 13M pixel or dual 8M pixel

VPU

Hardware decoding: 4K@60fps H265/H264/VP9 decoding, multi-format decoding of 1080P videos (VC-1, MPEG-1/2/4, VP8)

Hardware encoding: 1080P H.264/AVC/VP8

Video post-processing: deinterlacing, noise reduction, edge/detail/color optimization
RAM

LPDDR4 (2GB/4GB optional)

Storage

eMMC（16GB/32GB/64GB/128GB optional）

Power

5V (voltage tolerance ± 5%)

Interface

Gold finger (314 Pin, MXM3.0, 0.5mm pitch)

OS

Android and Linux OS

Size

82mm * 63mm

Environment

Operating temperature: -20℃～60℃

Operating humidity: 10%～90%RH (non-condensing)

Operating temperature: -20℃～70℃

Operating humidity: 10%～90%RH (non-condensing)
Interface Specifications Network

Integrated with GMAC/SDIO 3.0/USB 3.0, the core board enables expansion for Gigabit Ethernet,

2.4G Hz/5G Hz dual-band WiFi/Bluetooth, and 3G/4G LTE.
Video Input

2 * MIPI-CSI (4 lanes)

1 * DVP (supporting up to 5M pixel)
Video Output

1 * HDMI 2.0, supports 4K@60fps output and HDCP 1.4/2.2

1 * MIPI-DSI, supports single-channel 2560 * 1600@60fps output

1 * eDP 1.3 (4 lanes with 10.8Gbps)

1 * DP 1.2 (DisplayPort), supports up to 4K*2K@60Hz resolution (output from the Type-C)

* Support dual-display
Audio Output

1 * SPDIF, 3 * I2S (I2S0/I2S2 supporting 8-channel input/output and I2S2 providing audio output for HDMI/DP)

USB

2 * USB2.0 、2 * USB3.0
PCIe

1 * PCIe2.1

Other

8*I2C、8*SPI、5*UART、5*ADC 、5*PWM 、1 * SDMMC、GPIOs