Core-3399J
Hexa-Core High Performance Core Board

The Rockchip RK3399 series, a flagship processor, features a hexa-core 64-bit ARM architecture and 4K video decoding.
The core board offers diverse display interfaces, including HDMI 2.0, MIPI-DSI, eDP 1.3, and DP 1.2, achieving dual displays.
Additionally, it provides multiple peripheral interfaces such as Gigabit Ethernet, PCIe, USB 3.0, Type-C, and MIPI-CSI.The
device ensures reliable operation within a wide temperature range from -20°C to 70°C for uninterrupted 24/7 performance.
This core board is widely used in industrial computers, edge computing, computer vision, self-service terminals,
all-in-one digital signage, cloud servers, and more.

Hexa-core 64-bit processor

RK3399, Rockchip's flagship AIoT SoC, features a hexa-core 64-bit (A72x2 + A53x4) ARM architecture with a frequency of up to 1.8 GHz
and a quad-core Mali-T860 GPU. Multiple storage configurations are available, enabling users to rapidly advance project development
by extending backplanes.

Accelerate image recognition with dual ISP

Dual ISP, capable of processing at a maximum of 13 MPix/s for a single input or dual 8 MPix/s, supports simultaneous input from two cameras.
It enables advanced functions such as panoramic capture, gesture detection, depth sensing, and 3D processing, accelerating image recognition.

4K HD video decoding

This core board supports 4K VP9 and 4K 10-bit H265/H264 60fps video decoding, equipped with video post-processing functions,
including deinterlacing, noise reduction, and edge/detail/color optimization. It also supports 1080P (H.264, VP8) video encoding.

Multiple display interfaces

Dual VOP displays support 4096x2160 and 2560x1600 resolutions respectively, with multiple display interfaces available: dual-channel
MIPI-DSI, eDP 1.3, HDMI 2.0 (4K@60Hz with HDCP 1.4/2.2 support), and DisplayPort 1.2. These enable dual-screen output
with the same or different displays.

Strong network communication capability

Integrated with GMAC/SDIO 3.0/USB 3.0, the core board can be extended to Gigabit Ethernet, 2.4G Hz/5G Hz dual-band WiFi/Bluetooth,
and 3G/4G LTE, enabling higher-speed network communication.

314P MXM 3.0 for high performance

The 314P MXM3.0 interface provides access to all functionalities of the chip, maximizing data transfer and expansion performance.
Pins with an immersion gold process feature corrosion resistance. The core board can be fixed with four screws for reliability. Its
compact design, measuring only 82mm x 63mm, saves more space.

Extensive connectivity

A wide range of interface options includes PCIe, USB 2.0, USB 3.0, Type-C, MIPI-CSI, MIPI-DSI, I2C, SPI, UART, ADC, PWM, GPIO, SPDIF,
and I2S (supporting 8-channel digital microphone array input). These interfaces facilitate the connection of peripheral devices, enabling different
product applications across various fields.

Commercial and industrial grades

Core boards in commercial and industrial grades are available to meet diverse needs across various scenarios. The industrial-grade products operate
within a wide temperature range (-20°C to 70°C) for uninterrupted 24/7 stability, meeting industrial needs.

Support various operating systems

Android and Linux OS are supported. These provide a safe and stable system environment for product research and production to
meet user needs.

High-performance mainboard

The core board can be combined with a backplane to form a complete, high-performance mainboard. With expanded interfaces
and enhanced capabilities, it can be directly applied to various smart products to accelerate the product development.

Provide backplane reference design

We provide backplane reference design and technical information. So users can efficiently continue their secondary development
and quickly launch independent and controllable products.

Abundant resources

We offer SDKs, tutorials, technical documents, and development tools to streamline and enhance the development process.

A wide range of applications

This core board is widely used in industrial computers, edge computing, computer vision, self-service terminals, all-in-one digital
signage, cloud servers, and more.

computer vision
industrial computers
cloud servers
self-service terminals
edge computing
digital signage

Specifications

Core-3399J (Commercial) Core-3399KJ (Industrial)
Basic Specifications CPU

RK3399

Hexa-core 64-bit (Cortex-A72×2 + Cortex-A53×4) processor,

up to 1.8 GHz

RK3399K

Hexa-core 64-bit (Cortex-A72×2 + Cortex-A53×4) processor,

up to 2.0 GHz

GPU

Mali-T860 MP4 quad-core GPU, Support OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11

Support AFBC (Frame Buffer Compression)

ISP

Built-in dual hardware ISP, Support up to single 13M pixel or dual 8M pixel

VPU

Hardware decoding: 4K@60fps H265/H264/VP9 decoding, multi-format decoding of 1080P videos (VC-1, MPEG-1/2/4, VP8)

Hardware encoding: 1080P H.264/AVC/VP8

Video post-processing: deinterlacing, noise reduction, edge/detail/color optimization

RAM

LPDDR4 (2GB/4GB optional)

Storage

eMMC(16GB/32GB/64GB/128GB optional)

Power

5V (voltage tolerance ± 5%)

Interface

Gold finger (314 Pin, MXM3.0, 0.5mm pitch)

OS

Android and Linux OS

Size

82mm * 63mm

Environment

Operating temperature: -20℃~60℃

Operating humidity: 10%~90%RH (non-condensing)

Operating temperature: -20℃~70℃

Operating humidity: 10%~90%RH (non-condensing)

Interface Specifications Network

Integrated with GMAC/SDIO 3.0/USB 3.0, the core board enables expansion for Gigabit Ethernet,

2.4G Hz/5G Hz dual-band WiFi/Bluetooth, and 3G/4G LTE.

Video Input

2 * MIPI-CSI (4 lanes)

1 * DVP (supporting up to 5M pixel)

Video Output

1 * HDMI 2.0, supports 4K@60fps output and HDCP 1.4/2.2

1 * MIPI-DSI, supports single-channel 2560 * 1600@60fps output

1 * eDP 1.3 (4 lanes with 10.8Gbps)

1 * DP 1.2 (DisplayPort), supports up to 4K*2K@60Hz resolution (output from the Type-C)

* Support dual-display

Audio Output

1 * SPDIF, 3 * I2S (I2S0/I2S2 supporting 8-channel input/output and I2S2 providing audio output for HDMI/DP)

USB

2 * USB2.0 、2 * USB3.0

PCIe

1 * PCIe2.1

Other

8*I2C、8*SPI、5*UART、5*ADC 、5*PWM 、1 * SDMMC、GPIOs