Core-3399J
Hexa-Core High Performance Core Board
The Rockchip RK3399 series, a flagship processor, features a hexa-core 64-bit ARM architecture and 4K video
decoding.
The core board offers diverse display interfaces, including HDMI 2.0, MIPI-DSI, eDP 1.3, and DP 1.2, achieving
dual displays.
Additionally, it provides multiple peripheral interfaces such as Gigabit Ethernet, PCIe, USB 3.0,
Type-C, and MIPI-CSI.The
device ensures reliable operation within a wide temperature range from -20°C to 70°C for
uninterrupted 24/7 performance.
This core board is widely used in industrial computers, edge computing, computer vision,
self-service terminals,
all-in-one digital signage, cloud servers, and more.
Hexa-core 64-bit processor
RK3399, Rockchip's flagship AIoT SoC, features a hexa-core 64-bit (A72x2 + A53x4) ARM architecture with a
frequency of up to 1.8 GHz
and a quad-core Mali-T860 GPU. Multiple storage configurations are available, enabling users to rapidly advance
project development
by extending backplanes.
Accelerate image recognition with dual ISP
Dual ISP, capable of processing at a maximum of 13 MPix/s for a single input or dual 8 MPix/s, supports
simultaneous input from two cameras.
It enables advanced functions such as panoramic capture, gesture detection, depth sensing, and 3D processing,
accelerating image recognition.
4K HD video decoding
This core board supports 4K VP9 and 4K 10-bit H265/H264 60fps video decoding, equipped with video
post-processing functions,
including deinterlacing, noise reduction, and edge/detail/color optimization. It also supports 1080P (H.264,
VP8)
video
encoding.
Multiple display interfaces
Dual VOP displays support 4096x2160 and 2560x1600 resolutions respectively, with multiple display interfaces
available: dual-channel
MIPI-DSI, eDP 1.3, HDMI 2.0 (4K@60Hz with HDCP 1.4/2.2 support), and DisplayPort 1.2. These enable dual-screen
output
with the same or different displays.
Strong network communication capability
Integrated with GMAC/SDIO 3.0/USB 3.0, the core board can be extended to Gigabit Ethernet, 2.4G Hz/5G Hz
dual-band WiFi/Bluetooth,
and 3G/4G LTE, enabling higher-speed network communication.
314P MXM 3.0 for high performance
The 314P MXM3.0 interface provides access to all functionalities of the chip, maximizing data transfer and
expansion performance.
Pins with an immersion gold process feature corrosion resistance. The core board can be fixed with four screws
for reliability. Its
compact design, measuring only 82mm x 63mm, saves more space.
Extensive connectivity
A wide range of interface options includes PCIe, USB 2.0, USB 3.0, Type-C, MIPI-CSI, MIPI-DSI, I2C, SPI, UART,
ADC, PWM, GPIO, SPDIF,
and I2S (supporting 8-channel digital microphone array input). These interfaces facilitate the connection of
peripheral devices, enabling different
product applications across various fields.
Commercial and industrial grades
Core boards in commercial and industrial grades are available to meet diverse needs across various scenarios.
The industrial-grade products operate
within a wide temperature range (-20°C to 70°C) for uninterrupted 24/7 stability, meeting industrial needs.
Support various operating systems
Android and Linux OS are supported. These provide a safe and stable system environment for product research and
production to
meet user needs.
High-performance mainboard
The core board can be combined with a backplane to form a complete, high-performance mainboard. With expanded
interfaces
and enhanced capabilities, it can be directly applied to various smart products to accelerate the product
development.
Provide backplane reference design
We provide backplane reference design and technical information. So users can efficiently continue their
secondary development
and quickly launch independent and controllable products.
Abundant resources
We offer SDKs, tutorials, technical documents, and development tools to
streamline and enhance the development process.
