EC-OrinNX
AIBOX-OrinNX
EC-R3576PC FD
EC-I3588J
CSB1-N10NOrinNX
CSR2-N72R3399
Face X2
IPC-M10R800-A3399C V2
Core-186JD4
Core-3506BY
iCore-3576JQ
ROC-RK3506J-CC
AIO-3588JD4
CT36L/CT36B
This core board is powered by Rockchip RV1126K quad-core 32-bit processor, integrated with NEON and FPU,
and the clock speed is up to 1.5GHz. It supports long and stable operation in wide temperature range of -20°C-70°C. With
reliable operation, it can be widely used in
industrial equipment..
Low-consumption AI vision processor RV1126, with 14nm lithography process and quad-core 32-bit ARM Cortex-A7 architecture, integrates NEON and FPU — the frequency is up to 1.5GHz. It supports FastBoot, TrustZone technology and multiple crypto engines.
Built-in neural network processor NPU with computing power up to 2.0 Tops realizes that the power consumption of AI computing is less than 10% of the power required by the GPU. With tools and supporting AI algorithms provided, it supports direct conversion and deployment of Tensorflow, PyTorch, Caffe, MxNet, DarkNet, ONNX, etc.
With multi-level image noise reduction, 3F-HDR and other technologies, RV1126 not only ensures the dynamic range of the scene, but also meets the needs of outputting full color in darkness, making "clearly visible" a reality — more conforms to the actual demands in the security field.
Built-in Video CODEC supports 4K H.264/H.265@30FPS and multi-channel video encoding and decoding, meeting the needs of low bit rate, low-latency encoding, perceptual encoding and making the video occupancy smaller.
The core board pin adopts immersion gold process, which is anti-corrosion. Its size is only 69.6mm x 33.9mm, saving more valuable space.
It supports Buildroot+QT OS — occupies small space, starts fast, and provides stable and reliable operation.
SODIMM 260P, I2C, SPI, UART, ADC, PWM, GPIO, USB2.0, SDIO, I2S, MIPI-DSI, MIPI-CSI, CIF, SDMMC, PHY and
more are provided. They can meet the needs of various application.
The core board can be combined with a backplane to form a complete high-performance mainboard with richer expansion
interfaces. So it can be directly applied to various smart products to accelerate their development.
A complete SDK, including cross compiler toolchain, BSP source code, application development environment, development documents, examples, face recognition algorithms and other resources, is provided for the users to make a further customization.
It is widely used in face recognition, gesture recognition, gate access control, smart security, smart IP camera, smart doorbell/peephole, self-service terminals, smart finance, smart construction, smart travel and other industries.
Specification | Core-1126K-JD4 | Core-1126-JD4 |
SoC | RV1126K | RV1126 |
CPU |
Quad-core ARM Cortex-A7 32-bit, integrates NEON and FPU Each core has a 32KB I-cache, 32KB D-cache and 512KB shared second-level cache Based on RISC-V MCU |
|
NPU |
2.0Tops, supports INT8/ INT16, It has strong network model compatibility, can realize the conversion of commonly used AI framework models,eg: Tensor Flow/MXNet/PyTorch/Caffe/... |
|
RAM |
1GB / 2GB DDR4 |
|
Storage |
8GB / 16GB eMMC |
|
Video Encoding |
4K H.264/H.265 30fps video encoding: 3840 x 2160@30 fps+720p@30 fps encoding |
|
Video Decoding |
4K H.264/H.265 30fps video decoding: 3840 x 2160@30 encoding + 3840 x 2160@30 fps decoding |
|
Ethernet |
Supports 10/100/1000M Ethernet, With TSO(TCP Segmentation Offload) network acceleration |
|
WiFi |
Via SDIO 3.0 interface |
|
Display |
Supports MIPI-DSI interface 1080P @ 60 FPS |
|
Audio |
8-channel I2S with TDM/PDM, 2-channel I2S |
|
Camera |
Supports 3 cameras simultaneous input: 2 groups of MIPI CSI (or LVDS/sub LVDS) and 1 group of DVP (BT.601/BT.656/BT.1120) Supports 14M ISP 2.0 with 3-frame HDR(Line-based/Frame-based/DCG) |
|
Interface |
USB 2.0 OTG , USB 2.0 host 1000M Ethernet port, with TSO(TCP Segmentation Offload) network acceleration SDIO 3.0×2 (for Wi-Fi and SD card) 8-channel I2S with TDM/PDM, 2-channel I2S UART×6, SPI×2, I2C×6, GPIO, CAN, PWM |
|
OS |
Linux |
|
Dimension |
69.9mm × 33.96mm |
|
Interface Type |
Gold Finger (SODIMM 260P standard interface, 0.5mm distance) |
|
Operating Temperature |
-20°C-70°C |
-20°C-60°C |
Storage Temperature |
-20°C-85°C |
-20°C-70°C |
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