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Core-1126-JD4 is powered by the Rockchip RV1126 series processor, featuring an integrated AI neural network
accelerator NPU with up to
2.0 Tops computing power. It enables 4K H.265/H.264 multi-channel video encoding and decoding. The built-in
14-megapixel ISP 2.0
offers advanced multi-level noise reduction and 3-frame HDR technologies. This processor can handle simultaneous
inputs from three
cameras. This makes it an ideal solution for the demands of security products and AIoT. It is widely applied in
facial recognition, IP
cameras, gate access control, smart security, smart finance, smart construction sites, and smart transportation.
Rockchip RV1126, a processor for AI vision, features a quad-core 32-bit ARM Cortex-A7 architecture, integrated
with NEON and FPU.
With a frequency of up to 1.5 GHz, it supports FastBoot and TrustZone technology, as well as multiple
cryptographic engines.
The built-in 14-megapixel ISP 2.0 offers advanced multi-level noise reduction and 3-frame HDR technologies. It
not only ensures a
dynamic range for various scenes, but also meets the specific needs for full-color night vision. This makes
"seeing clearly" a reality,
perfectly meeting the demands of security products and the AIoT field.
The core board is capable of handling 4K H.264/H.265@30FPS and multi-channel video encoding and decoding. It is
well-equipped for scenarios
requiring low bitrate, low-latency encoding, and perceptual encoding, thus ensuring minimal storage
requirements.
It provides two groups of MIPI CSI/LVDS/sub LVDS and one group of 16-bit Digital Video Port (DVP) input,
enabling simultaneous input from 3 cameras.
The SODIMM 260P interface with an immersion gold process features corrosion resistance. Its compact design
measures only 69.6mm x 33.9mm
to save more space.
This core board supports Buildroot+QT, ensuring low resource occupancy, fast startup, stable performance, and reliable operation.
A wide range of interface options includes I2C, SPI, UART, PWM, GPIO, USB 2.0, I2S, MIPI-DSI, MIPI-CSI, DVP, and more.
Core boards in commercial and industrial grades are available to meet diverse needs across various scenarios.
The industrial-grade products operate
within a wide temperature range of -20°C to 70°C for uninterrupted 24/7 stability, meeting industrial needs.
The core board can be combined with a backplane to form a complete, high-performance mainboard. With expanded
interfaces
and enhanced capabilities, it can be directly applied to various smart products to accelerate product
development.
We provide backplane reference designs and technical information. So users can efficiently continue their
secondary development
and rapidly launch independent and controllable products.
We offer SDKs that include a cross-compilation chain, BSP source code, application development environment,
development documentation,
facial recognition algorithms, and more, allowing users to customize deeply and independently.
The device is widely applied in facial recognition, IP cameras, gate access control, smart security, smart
finance, smart construction sites,
and smart transportation.
Core-1126-JD4 (Commercial) | Core-1126K-JD4 (Industrial) | ||
Basic Specifications | SOC |
RV1126 Quad-core 32-bit ARM Cortex-A7, RISC-V MCU, up to 1.5GHz |
RV1126K Quad-core 32-bit ARM Cortex-A7, RISC-V MCU, up to 1.5GHz |
NPU |
Up to 2.0 TOPs, Support 8-bit/16-bit operation, Support TensorFlow, TensorFlow lite, Pytorch, Caffe, Mxnet, Darknet, Onnx |
||
ISP |
14MP ISP, 3-frame HDR |
||
VPU |
4K H.264/H.265 30fps video encoding, 3840×2160@30fps + 1080@30fps encoding 4K H.264/H.265 30fps video decoding, 3840×2160@30fps encoding + 3840×2160@30fps decoding |
||
RAM |
LPDDR4(1GB/2GB/4GB optional) |
||
Storage |
eMMC(8GB/16GB / 32GB optional) |
||
Power |
Core board supply voltage 5V (voltage tolerance ± 5%) |
||
Interface |
Gold finger (SODIMM 260P standard interface, 0.5mm pitch) |
||
OS |
Buildroot+QT |
||
Weight |
≈ 20g |
||
Size |
69.9mm × 33.96mm |
||
Environment |
Operating temperature: -20℃~60℃ Operating humidity: 10%~90%RH (non-condensing) |
Operating temperature: -20℃~70℃ Operating humidity: 10%~90%RH (non-condensing) |
|
Interface Specifications | Network |
Through the SDIO3.0, WiFi6/Bluetooth expansion is available; 4G/3G network expansion is supported Through GMAC, Gigabit Ethernet expansion is available and TSO (TCP Segmentation Offload) for network acceleration is supported |
|
Video Input |
2 * MIPI CSI (or LVDS/sub LVDS) 1 * DVP (BT.601/BT.656/BT.1120) Support simultaneous input from 3 cameras: 2 * MIPI CSI (or LVDS/sub LVDS) + 1 * DVP |
||
Video Output |
1*MIPI-DSI(Up to 1080P @ 60 FPS) |
||
Audio |
1 * I2S/PCM/TDM (8 channels), supporting microphone array, 2 * I2S/PCM (2 channels) |
||
USB |
1*USB 2.0 HOST、1*USB 2.0 OTG |
||
Other |
2*SPI、6*UART、6*I2C、1*CAN、4*PWM、GPIOs |
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