iCore-3588JQ

8K Industrial AI Core Board

Powered by Rockchip RK3588J new-gen industrial octa-core 64-bit processor, the core board supports up to 32GB
RAM and 8K video encoding and decoding. With industrial-grade SoC, precision components and BTB connector,
it delivers long and stable operation between -40°C and 85°C, satisfying the industrial-grade needs.Backplane
reference design and other open resources are provided for users to make further customization.

Octa-core industrial-grade processor RK3588J

Powered by Rockchip RK3588J octa-core 64-bit industrial-grade processor, its frequency is up to 2.2GHz, with 8nm
lithography process. Integrated with ARM Mali-G610 MP4 quad-core GPU and built-in AI acceleration NPU, it provides
6Tops computing power and supports mainstream deep learning frameworks. There are a variety of storage options,
which allows customers to quickly implement research and production.

8K video encoding and decoding

The core board supports 8K@60fps H.265/VP9 video decoding and 8K@30fps H.265/H.264 video encoding.
It also supports encoding and decoding simultaneously — up to 32-channel 1080P@30fps decoding and 16-channel
1080P@30fps encoding can be achieved. The strong video encoding and decoding capability makes 8K HD
display with more sharp detail available.

Super-large 32GB RAM

Up to 32GB RAM can be configured, which exceeds the limit of the previous RAM and speeds up response time. It can meet
the application requirements of products with large RAM and large storage.

Multi-channel input and output

With HDMI2.1/eDP1.3/MIPI-DSI/DP1.4/BT.1120 multi-channel video output and HDMI RX2.0 / MIPI-CSI / DVP video input ports,
this core board supports multi-channel 8K video output and 4K video input — up to seven-screen output with different displays
can be achieved. 48MP ISP with HDR&3DNR is integrated and dual MIPI-CSI camera input provided.

Strong network communication capability

Integrated with PCIe3.0/GMAC/SDIO3.0/USB3.0, it can be extended to multi-channel Gigabit Ethernet, WiFi 6/Bluetooth,
5G/4G LTE, enabling network communication with higher speed.

Multiple hard disks, massive capacity

PCIe3.0/SATA3.0 can be connected with multiple SSD/HDD mass storage devices, making it a reality that the
device can be easily expanded with TB storage capacity.

Firm and tight BTB port

The core board is equipped with high-speed industrial-grade connector, with high reliability and stability. BTB port, its connection
is tight and firm, which is more convenient to connect backplane.

Wide-temperature stable operation

It is equipped with industrial-grade SoC, precision components and connectors, so it can provide 7x24h continuous and stable
operation in the range of -40°C~85°C, satisfying industrial-grade needs.

More interfaces for more possibilities

PCIe3.0, SATA3.0, I2S, I2C, CAN, UART, SPDIF, SDIO3.0, MIPI-CSI, MIPI-DSI, USB3.0, USB2.0, SPI, GPIO are provided.

Form an industrial mainboard with backplane

The core board can be combined with the backplane to form a complete high-performance industrial mainboard with more expansion
interfaces, which can be directly applied to various industrial-grade products to accelerate the product development process.

Backplane reference design provided

Backplane reference design and complete technical information are provided, so users can efficiently proceed secondary development
to quickly create independent and controllable products.

Support various operating systems

Android 12.0, Ubuntu Desktop version and Server version, Debian11 and Buildroot are supported. And it supports RTLinux,
delivering excellent real-time performance.

Abundant resources

SDK, tutorials, tech docs and dev tools are provided, making development simpler and more convenient.

A wide range of applications

This core board can be widely used in ARM PC, edge computing, cloud server, smart NVR, smart video wall, AR/VR, smart car and other fields.

ARM PC
Edge computing
AR/VR
Smart NVR
Cloud server
Smart Car

Basic Specifications

Basic Specifications
SOC

RockChip RK3588J

CPU

Octa-core 64-bit (4×Cortex-A76+4×Cortex-A55), 8nm lithography process, clock speed up to 2.2GHz

GPU

ARM Mali-G610 MP4 quad-core GPU

Support OpenGL ES3.2 / OpenCL 2.2 / Vulkan1.1, 450 GFLOPS

NPU

NPU computing power up to 6 TOPS

Support INT4/INT8/INT16 mixed operation

Support framework switching of TensorFlow / MXNet / PyTorch / Caffe

ISP

Integrated 48MP ISP with HDR&3DNR

VPU

Video decoding:

8K@60fps H.265/VP9/AVS2

8K@30fps H.264 AVC/MVC

4K@60fps AV1

1080P@60fps MPEG-2/-1/VC-1/VP8

Video encoding:

8K@30fps encoding, support H.265 / H.264

*Up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps encoding can be achieved.

RAM

4GB/8GB/16GB (Up to 32GB optional) 64bit LPDDR4/LPDDR4x LPDDR5 (industrial grade)

Storage

16GB/32GB/64GB/128GB eMMC (industrial grade)

Hardware Specifications
Network

Integrated PCIe3.0/GMAC/SDIO3.0/USB3.1 (Gen1), can be extended to multi-channel Gigabit Ethernet,

WiFi6/Bluetooth and 5G/4G LTE

Display

Video output:

2×HDMI2.1 (8K@60fps or 4K@120fps, multiplexed with eDP)

2×MIPI-DSI (4K@60fps)

2×DP1.4 (8K@30fps, multiplexed with USB3.0)

1×BT.1120 (1080P@60fps)

Video input:

1×HDMI-IN (4K@60fps), support HDCP 2.3

2×MIPI CSI (4 Lane) or 4×MIPI CSI (2 Lane) or 1×MIPI CSI (4 Lane)  + 2×MIPI CSI (2 Lane)

2×MIPI CSI (2 Lane)

2×MIPI DC (4-lane DPHY v2.0 or 3-lane CPHY V1.1)

1×DVP camera interface (up to 150MHz data input)

* Support multi-channel 8K video output and 4K video input.

Up to seven-screen output with different displays can be achieved.

Audio

2 × 8 Lane I2S

2 × 2 Lane I2S

2 × SPDIF

2 × 8 Lane PDM (support multi-Mic array)

1 × dual-channel digital audio codec (16-bit DAC)

1 × VAD

PCIE

PCIe3.0 (2×2lanes, 1×4lanes, 4×1lanes) 

1×PCIE2.1 (1 lanes)

SATA

3 × SATA3.0

USB

3×USB3.1 (Gen1), 2×USB2.0 Host, 2×USB2.0 OTG

Watchdog

Support independent watchdog

Power

4V (voltage tolerance±5%)

Other Interfaces

9×I2C, 10×UART, 5×SPI, 4×ADC , 16×PWM , 1×SDMMC and GPIO

OS/Software
OS

Android 12.0, Ubuntu Desktop and Server, Debian11 and Buildroot

RTLinux (delivering excellent real-time performance)

General
Dimension

66 mm × 50 mm

Weight

≈20g

Interface Type

BTB connector (1×100Pin + 3×80Pin)

Power Consumption

Idle: 0.04W (4.0V/10mA)

Typical: 1W (4.0V/250mA)

Max: 12W (4.0V/3000mA)

Environment

Operating Temperature: -40℃~85℃

Storage Humidity: 10%~80 %