Powered by Rockchip RK3588J new-gen industrial octa-core 64-bit processor, the core board supports up to 32GB
RAM and 8K video encoding and decoding. With industrial-grade SoC, precision components and BTB connector,
it delivers long and stable operation between -40°C and 85°C, satisfying the industrial-grade needs.Backplane
reference design and other open resources are provided for users to make further customization.
Powered by Rockchip RK3588J octa-core 64-bit industrial-grade processor, its frequency is up to 2.2GHz, with 8nm
lithography process. Integrated with ARM Mali-G610 MP4 quad-core GPU and built-in AI acceleration NPU, it provides
6Tops computing power and supports mainstream deep learning frameworks. There are a variety of storage options,
which allows customers to quickly implement research and production.
The core board supports 8K@60fps H.265/VP9 video decoding and 8K@30fps H.265/H.264 video encoding.
It also supports encoding and decoding simultaneously — up to 32-channel 1080P@30fps decoding and 16-channel
1080P@30fps encoding can be achieved. The strong video encoding and decoding capability makes 8K HD
display with more sharp detail available.
Up to 32GB RAM can be configured, which exceeds the limit of the previous RAM and speeds up response time. It can meet
the application requirements of products with large RAM and large storage.
With HDMI2.1/eDP1.3/MIPI-DSI/DP1.4/BT.1120 multi-channel video output and HDMI RX2.0 / MIPI-CSI / DVP video input ports,
this core board supports multi-channel 8K video output and 4K video input — up to seven-screen output with different displays
can be achieved. 48MP ISP with HDR&3DNR is integrated and dual MIPI-CSI camera input provided.
Integrated with PCIe3.0/GMAC/SDIO3.0/USB3.0, it can be extended to multi-channel Gigabit Ethernet, WiFi 6/Bluetooth,
5G/4G LTE, enabling network communication with higher speed.
PCIe3.0/SATA3.0 can be connected with multiple SSD/HDD mass storage devices, making it a reality that the
device can be easily expanded with TB storage capacity.
The core board is equipped with high-speed industrial-grade connector, with high reliability and stability. BTB port, its connection
is tight and firm, which is more convenient to connect backplane.
It is equipped with industrial-grade SoC, precision components and connectors, so it can provide 7x24h continuous and stable
operation in the range of -40°C~85°C, satisfying industrial-grade needs.
PCIe3.0, SATA3.0, I2S, I2C, CAN, UART, SPDIF, SDIO3.0, MIPI-CSI, MIPI-DSI, USB3.0, USB2.0, SPI, GPIO are provided.
The core board can be combined with the backplane to form a complete high-performance industrial mainboard with more expansion
interfaces, which can be directly applied to various industrial-grade products to accelerate the product development process.
Backplane reference design and complete technical information are provided, so users can efficiently proceed secondary development
to quickly create independent and controllable products.
Android 12.0, Ubuntu Desktop version and Server version, Debian11 and Buildroot are supported. And it supports RTLinux,
delivering excellent real-time performance.
SDK, tutorials, tech docs and dev tools are provided, making development simpler and more convenient.
This core board can be widely used in ARM PC, edge computing, cloud server, smart NVR, smart video wall, AR/VR, smart car and other fields.
Octa-core 64-bit (4×Cortex-A76+4×Cortex-A55), 8nm lithography process, clock speed up to 2.2GHz
ARM Mali-G610 MP4 quad-core GPU
Support OpenGL ES3.2 / OpenCL 2.2 / Vulkan1.1, 450 GFLOPS
NPU computing power up to 6 TOPS
Support INT4/INT8/INT16 mixed operation
Support framework switching of TensorFlow / MXNet / PyTorch / Caffe
Integrated 48MP ISP with HDR&3DNR
8K@30fps H.264 AVC/MVC
8K@30fps encoding, support H.265 / H.264
*Up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps encoding can be achieved.
4GB/8GB/16GB (Up to 32GB optional) 64bit LPDDR4/LPDDR4x LPDDR5 (industrial grade)
16GB/32GB/64GB/128GB eMMC (industrial grade)
Integrated PCIe3.0/GMAC/SDIO3.0/USB3.1 (Gen1), can be extended to multi-channel Gigabit Ethernet,
WiFi6/Bluetooth and 5G/4G LTE
2×HDMI2.1 (8K@60fps or 4K@120fps, multiplexed with eDP)
2×DP1.4 (8K@30fps, multiplexed with USB3.0)
1×HDMI-IN (4K@60fps), support HDCP 2.3
2×MIPI CSI (4 Lane) or 4×MIPI CSI (2 Lane) or 1×MIPI CSI (4 Lane) + 2×MIPI CSI (2 Lane)
2×MIPI CSI (2 Lane)
2×MIPI DC (4-lane DPHY v2.0 or 3-lane CPHY V1.1)
1×DVP camera interface (up to 150MHz data input)
* Support multi-channel 8K video output and 4K video input.
Up to seven-screen output with different displays can be achieved.
2 × 8 Lane I2S
2 × 2 Lane I2S
2 × SPDIF
2 × 8 Lane PDM (support multi-Mic array)
1 × dual-channel digital audio codec (16-bit DAC)
1 × VAD
PCIe3.0 (2×2lanes, 1×4lanes, 4×1lanes)
1×PCIE2.1 (1 lanes)
3 × SATA3.0
3×USB3.1 (Gen1), 2×USB2.0 Host, 2×USB2.0 OTG
Support independent watchdog
4V (voltage tolerance±5%)
9×I2C, 10×UART, 5×SPI, 4×ADC , 16×PWM , 1×SDMMC and GPIO
Android 12.0, Ubuntu Desktop and Server, Debian11 and Buildroot
RTLinux (delivering excellent real-time performance)
66 mm × 50 mm
BTB connector (1×100Pin + 3×80Pin)
Idle: 0.04W (4.0V/10mA)
Typical: 1W (4.0V/250mA)
Max: 12W (4.0V/3000mA)
Operating Temperature: -40℃～85℃
Storage Humidity: 10%～80 %
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