Adopts PX30 industrial grade 64-bit low-power processor, with powerful hardware decoding capability and rich interface, users only need to expand the function backplane to quickly achieve project development. It can be applied to AIOT equipment, vehicle control, game equipment, commercial display equipment, etc.
Adopts PX30 industrial grade 64-bit low-power processor with quad-core Cortex-A35 and dual-core Mali-G31 GPU. A variety of storage configuration options are available, users only need to expand the function backplane to quickly achieve project development.
Supports RGB / LVDS / MIPI-DSI interface, dual VOP (dual screen display), and multi-format 1080P 60fps video decoding (H.265, H.264, VC-1, MPEG-1/2/4, VP8 ), 1080P (H.264, VP8 format) video encoding
With immersion gold process pin, corrosion resistant, 2 studs fixed, stable operation at -10°C - 60°C working temperature for 7X24 hours.
Measurement is only 69.6mm x 49.6mm for saving more precious space. With SODIMM 260P interface, the data transmission and expansion performance can be best achieved.
With rich interfaces such as I2C, UART, SPI, SDIO3.0, USB2.0, PWM, RMII, I2S(supports 8-way digital microphone array input), and others.
Core-PX30-JD4 core board can be combined with the backplane to form a complete high-performance industry application main board with more interfaces, more applicability. The main board can be directly applied to a variety of intelligent products.
High Performance Computing/Storage
|SoC||Rockchip PX30K||Rockchip PX30|
Quad-Core Cortex-A35 processor
Mali-G31GPU, Support OpenGL ES3.2, Vulkan 1.0, OpenCL 2.0
Built-in embedded high-performance 2D acceleration hardware
Multi-format1080P 60fps video decoding (H.265,H.264,VC-1, MPEG-1/2/4, VP8)
1080P video coding, support H.264,VP8
Support MLC NAND
100 Mbps Ethernet interface
Support RGB/LVDS/MIPI-DSI interface,
Support dual-VOP（Dual display）,Resolution up to 1920x1080
1 x SPDIF, for audio output
1 x 8ch I²S /TDM, 1×8ch PDM, 1×2ch I²S/PCM
1 x OTG，1 x USB2.0 HOST
Support infrared remote control function
I2C, UART, SPI, SDIO3.0, USB2.0, PWM, RMII,
I2S（Support 8-way digital microphone array input）
DC input voltage 5V
69.6mm × 49.6 mm
Gold finger（SODIMM 260P, 0.5mm pitch）
6-layer board design
-20℃ ~ 85℃
-20 ℃-60 ℃
-20℃ ~ 85℃
-20 ℃-70 ℃
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