8K AI Core Board
Powered by a new-gen flagship octa-core 64-bit
processor Rockchip RK3588S, the core board can be configured with up to 32GB
of RAM and supports 8K video encoding and decoding. A wide range of interface options include multiple hard disks, Gigabit Ethernet,
WiFi6, 5G/4G and multiple video input and output interfaces. It also supports multiple operating systems and uses BGA package for
a more compact and stable design. The core board can be applied to ARM PC, edge computing, cloud servers, intelligent NVR,
and other fields.
RK3588S is Rockchip's new-gen flagship AIoT SoC with 8nm lithography process. It
features an octa-core 64-bit CPU and frequency
of up to 2.4GHz. Integrated with ARM Mali-G610 MP4 quad-core GPU and built-in AI accelerator NPU, it provides 6Tops computing power
and supports mainstream deep learning frameworks. The powerful RK3588S delivers more optimized performance in various AI
The core board supports 8K@60fps H.265/VP9 video decoding and 8K@30fps
H.265/H.264 video encoding, with simultaneous
encoding and decoding capabilities. It can achieve up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps encoding.
The powerful video encoding and decoding performance delivers 8K high-definition display and delicate picture quality.
Up to 32GB of super-large RAM can be configured, which exceeds the limit of the
previous RAM and delivers a faster response speed.
It is able to meet the application requirements of products with large RAM.
It supports HDMI 2.1 (8K), DP1.4 (8K), and dual
MIPI-DSI multi-channel video output — up to four-screen output with
different displays can be achieved. Dual MIPI-CSI camera input is also provided.
Integrated with PCIe/GMAC/SDIO3.0/USB3.0, it can be extended to Gigabit Ethernet,
WiFi 6/Bluetooth, 5G/4G LTE,
enabling higher-speed network communication.
PCIe 2.0 and SATA 3.0 interfaces can be connected with multiple SSD/HDD
simultaneously, enabling the
device to be easily expanded to TB storage capacity.
The core board uses a BGA package with a compact design—containing a total of 371
pins, which bring out all the chip interfaces. It can be
applied to various intelligent products, accelerating product development.
Backplane reference design and complete technical information are provided, so
users can efficiently proceed with secondary development to
quickly create independent and controllable products.
Android 12.0, Ubuntu, Debian11, Buildroot, RTLinux and Kylin Linux are supported.
SDK, tutorials, tech docs and development tools are provided, making development simpler and more convenient.
The core board can be widely used in edge computing,
Artificial Intelligence, cloud computing, VR/AR, blockchain, smart
security, smart home, intelligent retail and smart industry.
Octa-core 64-bit (4*Cortex-A76+4*Cortex-A55), 8nm lithography process, frequency up to 2.4GHz
ARM Mali-G610 MP4 quad-core GPU
Support OpenGL ES3.2 / OpenCL 2.2 / Vulkan1.1, 450 GFLOPS
Support INT4/INT8/INT16 mixed operation,
Support framework switching of TensorFlow / MXNet / PyTorch / Caffe
8K@30fps H.264 AVC/MVC
support H.265 / H.264
4GB/8GB/16GB (Up to 32GB optional) 64bit LPDDR4/LPDDR4x/LPDDR5
Integrated GMAC/SDIO3.0/USB3.0 interface, expanded to GbE, WiFi6/Bluetooth and 5G/4G LTE
1 * HDMI2.1 (8K@60fps or 4K@120fps)
2 * MIPI-DSI (4K@60fps)
1 * DP1.4 (8K@30fps),
1* eDP1.3 (4 Lane) (4K@60Hz)
1* BT.1120 (1080@60fps)
* Up to four-screen output with different displays can be achieved.
2 * MIPI DC (4 Lane DPHY v2.0 or 3 Lane CPHY V1.1)
1 * MIPI CSI (4 Lane) or 2 * MIPI CSI (2 Lane),
1 * DVP camera interface (up to 150MHz data input)
2 * 8 Lane I2S
2 * 2 Lane I2S
2 * SPDIF
2 * 8 Lane PDM (support multi-Mic array)
1 * dual-channel digital audio codec (16-bit DAC)
1 * VAD
|PCIe / SATA||
2 * PCIe2.0、2 * SATA3.0
3 * USB3.0、2 * USB2.0（Host） 、1 × USB2.0（OTG）
Voltage 4V (±5%), electric current 4A or higher recommended
9 * I2C, 10 * UART, 5 * SPI, 12 * ADC, 3 * CAN, 16 * PWM, 1 * SDMMC, Multiple GPIO
Android 12.0, Ubuntu, Debian11, Buildroot, RTLinux, Kylin Linux
50mm * 50mm
BGA371(body: 50mmx50mm; ball size: 0.5mm; ball pitch: 1.0mm)
Normal: 1.0W (4.0V/250mA)，
Max: 11.2W (4.0V/2800mA)，
Min (sleep): 0.06W (4V/15mA)
Operating Temperature: -20℃～60℃
Storage Temperature: -20℃～70℃
Operating humidity: 10%～90% (non-condensing)