8K AI Core Board

Powered by a new-gen flagship octa-core 64-bit processor Rockchip RK3588S, the core board can be configured with up to 32GB
of RAM and supports 8K video encoding and decoding. A wide range of interface options include multiple hard disks, Gigabit Ethernet,
WiFi6, 5G/4G and multiple video input and output interfaces. It also supports multiple operating systems and uses BGA package for
a more compact and stable design. The core board can be applied to ARM PC, edge computing, cloud servers, intelligent NVR,
and other fields.

New-gen AIoT SoC

RK3588S is Rockchip's new-gen flagship AIoT SoC with 8nm lithography process. It features an octa-core 64-bit CPU and frequency
of up to 2.4GHz. Integrated with ARM Mali-G610 MP4 quad-core GPU and built-in AI accelerator NPU, it provides 6Tops computing power
and supports mainstream deep learning frameworks. The powerful RK3588S delivers more optimized performance in various AI
application scenarios.

8K video encoding and decoding

The core board supports 8K@60fps H.265/VP9 video decoding and 8K@30fps H.265/H.264 video encoding, with simultaneous
encoding and decoding capabilities. It can achieve up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps encoding.
The powerful video encoding and decoding performance delivers 8K high-definition display and delicate picture quality.

Super-large 32GB RAM

Up to 32GB of super-large RAM can be configured, which exceeds the limit of the previous RAM and delivers a faster response speed.
It is able to meet the application requirements of products with large RAM.

Multi-channel video output

It supports HDMI 2.1 (8K), DP1.4 (8K), and dual MIPI-DSI multi-channel video output — up to four-screen output with
different displays can be achieved. Dual MIPI-CSI camera input is also provided.

Strong network communication capability

Integrated with PCIe/GMAC/SDIO3.0/USB3.0, it can be extended to Gigabit Ethernet, WiFi 6/Bluetooth, 5G/4G LTE,
enabling higher-speed network communication.

Multiple storage expansion, massive capacity

PCIe 2.0 and SATA 3.0 interfaces can be connected with multiple SSD/HDD simultaneously, enabling the
device to be easily expanded to TB storage capacity.

BGA package, smaller and more powerful

The core board uses a BGA package with a compact design—containing a total of 371 pins, which bring out all the chip interfaces. It can be
applied to various intelligent products, accelerating product development.

Provide backplane reference design

Backplane reference design and complete technical information are provided, so users can efficiently proceed with secondary development to
quickly create independent and controllable products.

Support various operating systems

Android 12.0, Ubuntu, Debian11, Buildroot, RTLinux and Kylin Linux are supported.

Abundant resources

SDK, tutorials, tech docs and development tools are provided, making development simpler and more convenient.

A wide range of applications

The core board can be widely used in edge computing, Artificial Intelligence, cloud computing, VR/AR, blockchain, smart
security, smart home, intelligent retail and smart industry.

Edge computing
Smart NVR
Cloud server
Smart home



RockChip RK3588S


Octa-core 64-bit (4*Cortex-A76+4*Cortex-A55), 8nm lithography process, frequency up to 2.4GHz


ARM Mali-G610 MP4 quad-core GPU

Support OpenGL ES3.2 / OpenCL 2.2 / Vulkan1.1, 450 GFLOPS



Support INT4/INT8/INT16 mixed operation,

Support framework switching of TensorFlow / MXNet / PyTorch / Caffe


Video decoding:

8K@60fps H.265/VP9/AVS2

8K@30fps H.264 AVC/MVC

4K@60fps AV1

1080P@60fps MPEG-2/-1/VC-1/VP8

Video encoding:

8K@30fps encoding

support H.265 / H.264


4GB/8GB/16GB (Up to 32GB optional) 64bit LPDDR4/LPDDR4x/LPDDR5 


16GB/32GB/64GB/128GB/256GB eMMC

Hardware Specifications

Integrated GMAC/SDIO3.0/USB3.0 interface, expanded to GbE, WiFi6/Bluetooth and 5G/4G LTE

Video Output

1 * HDMI2.1 (8K@60fps or 4K@120fps)

2 * MIPI-DSI (4K@60fps)

1 * DP1.4 (8K@30fps),

1* eDP1.3 (4 Lane) (4K@60Hz)

1* BT.1120 (1080@60fps)  

* Up to four-screen output with different displays can be achieved.

Video Input

2 * MIPI DC (4 Lane DPHY v2.0 or 3 Lane CPHY V1.1)

1 * MIPI CSI (4 Lane) or 2 * MIPI CSI (2 Lane),

1 * DVP camera interface (up to 150MHz data input)


2 * 8 Lane I2S

2 * 2 Lane I2S


2 * 8 Lane PDM (support multi-Mic array)

1 * dual-channel digital audio codec (16-bit DAC)

1 * VAD


2 * PCIe2.0、2 * SATA3.0


3 * USB3.0、2 * USB2.0(Host) 、1 × USB2.0(OTG)


Voltage 4V (±5%), electric current 4A or higher recommended

Other Interfaces

9 * I2C, 10 * UART, 5 * SPI, 12 * ADC, 3 * CAN, 16 * PWM, 1 * SDMMC, Multiple GPIO


Android 12.0, Ubuntu, Debian11, Buildroot, RTLinux, Kylin Linux


50mm * 50mm

Interface Type

BGA371(body: 50mmx50mm; ball size: 0.5mm; ball pitch: 1.0mm)



Power Consumption

Normal: 1.0W (4.0V/250mA),

Max: 11.2W (4.0V/2800mA),

Min (sleep): 0.06W (4V/15mA)


Operating Temperature: -20℃~60℃

Storage Temperature: -20℃~70℃

Operating humidity: 10%~90% (non-condensing)