Core-3588J

8K AI Core Board

Powered by Rockchip RK3588 new-gen 8-core 64-bit processor, the
core board can be configured with up to 32GB RAM. Capable of 8K
video encoding and decoding, it provides abundant interfaces
supporting multiple hard disks, Gigabit Ethernet, WiFi6, 5G/4G
expansion and a variety of video input and output. It also supports
various operating systems. This core board can be used in ARM PC,
edge computing, cloud server, smart NVR and other fields.

New-gen AIoT SoC RK3588

RK3588 is Rockchip's new-gen flagship AIoT SoC with 8nm lithography process. Equipped with 8-core 64-bit CPU, it has frequency up to
2.4GHz. Integrated with ARM Mali-G610 MP4 quad-core GPU and built-in AI acceleration NPU, it provides 6Tops computing power and
supports mainstream deep learning frameworks. The powerful RK3588 can deliver more optimized performance in various
AI application scenarios.

8K video encoding and decoding

The core board supports 8K@60fps H.265/VP9 video decoding and 8K@30fps H.265/H.264 video encoding, and also supports encoding
and decoding simultaneously — achieves up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps encoding. The strong
video encoding and decoding capability makes 8K HD display and delicate picture quality available.

Super-large 32GB RAM

Up to 32GB of super-large RAM can be configured, which exceeds the limit of the previous RAM and delivers a faster response speed. It
can meet the application requirements of products with large RAM and large storage.

Multi-channel input and output

With HDMI 2.1/eDP1.3/MIPI-DSI/DP1.4/BT.1120 multi-channel video output and HDMI RX2.0/MIPI-CSI/DVP video input interfaces, it
supports multi-channel 8K video output and 4K video input — up to seven-screen output with different displays can be achieved.
The integrated 48MP ISP with HDR&3DNR supports dual MIPI-CSI camera input.

Strong network communication capability

Integrated with PCIe3.0/GMAC/SDIO3.0/USB3.0, it can be extended to multi-channel Gigabit Ethernet, WiFi 6/Bluetooth,
5G/4G LTE, enabling network communication have a higher speed.

Multiple hard disks, Massive capacity

It supports expansion of multiple PCIe3.0/SATA3.0 SSD/HDD mass storage devices at the same time, making it
a reality that the device can be easily expanded with TB storage capacity.

More interfaces for more possibilities

It’s equipped with PCIE3.0, SATA3.0, I2S, I2C, CAN, UART, SPDIF, SDIO3.0, MIPI-CSI, MIPI-DSI, USB3.0, USB2.0, SPI,
GPIO and other expansion interfaces.

High-performance ITX mainboard

The core board, with standard MXM3.0-314P interface, which is small in size, can be combined with a backplane to form a
complete high-performance ITX mainboard with richer expansion interfaces, which can be directly applied to various smart
products to accelerate the product development process.

Backplane reference design is provided

Backplane reference design and complete technical information are provided, so users can efficiently proceed secondary
development to quickly create independent and controllable products.

Supports various operating systems

Android 12.0, Ubuntu Desktop version and Server version, Debian11, Buildroot, Kylin and UOS are supported. And it supports RTLinux,
delivering excellent real-time performance. Also, UEFI Boot is available. The stable and reliable operation provides a safe and stable
system environment for product research and production.

Abundant resources

SDK, tutorials, tech docs and dev tools are provided, making development simpler and more convenient.

A wide range of applications

The core board can be used in edge computing, cloud server, ARM PC, smart NVR, intelligent cockpit, smart video wall, AR/VR, high-end tablet, multi-lens camera, smart car and other fields.The core board can be used in edge computing, cloud server, ARM PC, smart NVR, intelligent cockpit, smart video wall, AR/VR,
high-end tablet, multi-lens camera, smart car and other fields.

ARM PC
Edge computing
AR/VR
Smart NVR
Cloud server
Smart Car

Specifications

Basic Specifications
SOC

RockChip RK3588

CPU

8-core 64-bit (4×Cortex-A76+4×Cortex-A55) , 8nm lithography process, frequency up to 2.4GHz

GPU

ARM Mali-G610 MP4 quad-core GPU

Supports OpenGL ES3.2 / OpenCL 2.2 / Vulkan1.1, 450 GFLOPS

NPU

NPU computing power is up to 6 TOPS, Supports INT4/INT8/INT16 mixed operation,

Supports framework switching of TensorFlow / MXNet / PyTorch / Caffe / etc.

ISP

Integrated 48MP ISP with HDR&3DNR

VPU

Video decoding:

8K@60fps H.265/VP9/AVS2

8K@30fps H.264 AVC/MVC

4K@60fps AV1

1080P@60fps MPEG-2/-1/VC-1/VP8

Video encoding:

8K@30fps encoding, Supports H.265 / H.264

* Achieves up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps encoding

RAM

4GB/8GB/16GB 64bit LPDDR4/LPDDR4x/LPDDR5 (Up to 32GB optional)

Storage

16GB/32GB/64GB/128GB eMMC

Hardware Specifications
Network

Integrated with PCIe3.0/GMAC/SDIO3.0/USB3.0, it can be extended to multi-channel Gigabit Ethernet,
WiFi 6/Bluetooth, 5G/4G LTE

Display

Video output:

1 × HDMI2.1 ( 8K@60fps or 4K@120fps)

1 × HDMI2.0 ( 4K@60fps)

2 × MIPI-DSI ( 4K@60fps)

2 × DP1.4 ( 8K@30fps, multiplexed with USB3.0)

2 × eDP1.3 ( 4K@60Hz)

1 × BT.1120 ( 1080@60fps)

Video input:

1 × HDMI-IN ( 4K@60fps) , supports HDCP 2.3

1 × MIPI CSI (4 lanes) or 2×MIPI CSI (2 lanes)

2 × MIPI DC ( 4-lane DPHY v2.0 or 3-lane CPHY V1.1)

1 × DVP camera (up to 150MHz input data)

* Supports multi-channel 8K video output and 4K video input,

up to seven-screen output with different displays

Audio

2 × 8-channel I2S

2 × 2-channel I2S

2 × SPDIF

2 × 8-channel PDM (supports multi-MIC array)

1 × Dual-channel digital audio codec (16-bit DAC)

1 × VAD

PCIE

PCIe3.0 (2×2lanes,1×4lanes,4×1lanes) 、3×PCIE2.0(1 lanes)

SATA

3 × SATA3.0

USB

3 × USB3.0、4 × USB2.0 Host 2 × USB2.0 OTG

Power

4V (error±5%)

Other Interfaces

9 × I2C、10 × UART、5 × SPI、7 × ADC 、16 × PWM 、1 × SDMMC、GPIO

OS/Software
OS

Android: Android 12.0

Linux: Ubuntu Desktop, Ubuntu Server, Debian11, Buildroot, RTLinux, Kylin Linux, UOS

* Supports UEFI Boot

General
Size

82 mm × 53 mm

Interface Type

MXM3.0 ( 314 PIN, 0.5mm pitch)

PCB

10-layer design, immersion gold technology

Heat Dissipation

Heat sink installation hole pitch: 45mm

Power Consumption

Idle: ≈1.35W (12V/110mA)

Typical: ≈4.8W (12V/400mA)

Max: ≈20W (12V/1700mA)

Environment

Operating Temperature: -20℃-60℃,

Storage Temperature: -20℃-70℃,

Storage Humidity: 10%-80%