Core-3588SJD4

8-Core 8K AI Core Board

Powered by Rockchip RK3588S new-gen 8-core 64-bit processor, the
core board can be configured with up to 32GB RAM. Capable of 8K
video encoding and decoding, it provides abundant interfaces,
supporting multiple hard disks, Gigabit Ethernet and dual-band WiFi6.
It also supports various operating systems. Backplane reference
design is provided for users to make further customization.

RK3588S a new generation of high-end processor

RK3588S is Rockchip's new-gen flagship AIoT SoC with 8nm lithography process. Equipped with 8-core 64-bit CPU, it has frequency
up to 2.4GHz. Integrated with ARM Mali-G610 MP4 quad-core GPU and built-in AI accelerator NPU, it provides 6Tops computing
power and supports mainstream deep learning frameworks. The powerful RK3588S can deliver more optimized performance
in various AI application scenarios.

8K video encoding and decoding

The core board supports 8K@60fps H.265/VP9 video decoding and 8K@30fps H.265/H.264 video encoding, and also
supports encoding and decoding simultaneously — up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps
encoding can be achieved. The strong video encoding and decoding capability makes 8K HD display and delicate picture
quality available.

Super-large 32GB RAM

Up to 32GB of super-large RAM can be configured, which exceeds the limit of the previous RAM and delivers a faster response speed.
It can meet the application requirements of products with large RAM and large storage.

Multi-channel input and output

It supports HDMI 2.1 (8K), DP1.4 (8K), and dual MIPI-DSI multi-channel video output — up to four-screen output with different displays can be achieved. Dual MIPI-CSI camera input is also supported.

Strong network communication capability

Integrated with PCIe/GMAC/SDIO3.0/USB3.0, it can be extended to Gigabit Ethernet, WiFi 6/Bluetooth, 5G/4G LTE,
enabling network communication have a higher speed.

Multiple hard disks, Massive capacity

PCIe2.1 and SATA3.0 interfaces can be connected with multiple SSD/HDD mass storage devices at the same
time, making it a reality that the device can be easily expanded with TB storage capacity.

A variety of interfaces

SATA3.0, PCIe2.1, I2S, I2C, CAN, UART, SPDIF, SDIO3.0, MIPI-CSI, MIPI-DSI, USB3.0, USB2.0, SPI and GPIO are configured.

High-performance mainboard

The core board with 260Pin standard SODIMM interface, which is small in size. It can be combined with a backplane to form a
complete high-performance mainboard with richer expansion interfaces. So it can be directly applied to various smart products to
accelerate their development.

Provide backplane reference design

Backplane reference design and complete technical information are provided, so users can efficiently proceed with secondary
development to quickly create independent and controllable products.

Support various operating systems

Android 12.0, Ubuntu Desktop version and Server version, Debian11, Buildroot, Kylin and UOS are supported. It supports RTLinux,
delivering excellent real-time performance. UEFI Boot is also available. The reliable operation provides a safe and stable system
environment for product research and production.

Abundant resources

SDK, tutorials, tech docs and development tools are provided, making development simpler and more convenient.

A wide range of applications

The core board can be widely used in edge computing, Artificial Intelligence, cloud computing, VR/AR, blockchain,
smart security, smart home, intelligent retail and smart industry.

AI
Edge computing
AR/VR
Smart NVR
Cloud server
Smart home

Specifications

Basic Specifications
SOC

RockChip RK3588S

CPU

8-core 64-bit (4×Cortex-A76+4×Cortex-A55), 8nm lithography process, frequency up to 2.4GHz

GPU

ARM Mali-G610 MP4 quad-core GPU

Support OpenGL ES3.2 / OpenCL 2.2 / Vulkan1.1, 450 GFLOPS

NPU

NPU computing power up to 6 TOPS,

Support INT4/INT8/INT16 mixed operation,

Support framework switching of TensorFlow / MXNet / PyTorch / Caffe

ISP

Integrated 48MP ISP with HDR&3DNR Integrated 48MP ISP with HDR&3DNR

VPU

Video decoding:

8K@60fps H.265/VP9/AVS2

8K@30fps H.264 AVC/MVC

4K@60fps AV1

1080P@60fps MPEG-2/-1/VC-1/VP8

Video encoding:

8K@30fps encoding, support H.265 / H.264

*Achieve up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps encoding

RAM

4GB/8GB/16GB 64bit LPDDR4/LPDDR4x/LPDDR5 (Up to 32GB optional)

Storage

16GB/32GB/64GB/128GB eMMC

Hardware Specifications
Network

Integrated GMAC/SDIO3.0/USB3.0 interface, can be expanded with GbE, WiFi6/Bluetooth and 5G/4G LTE

Video Output

1 × HDMI2.1 (8K@60fps or 4K@120fps)

2 × MIPI-DSI (4K@60fps)

1 × DP1.4 (8K@30fps)

2 × eDP1.3 (4K@60Hz)

1 × BT.1120 (1080@60fps)

* Up to four-screen output with different displays can be achieved.

Video Input

2 × MIPI DC (4 Lane DPHY v2.0 or 3 Lane CPHY V1.1)

1 × MIPI CSI (4 Lane) or 2×MIPI CSI (2 Lane) 

1 × DVP camera interface (up to 150MHz data input )

Audio

2 × 8 Lane I2S

2 × 2 Lane I2S

2 × SPDIF

2 × 8 Lane PDM (support multi-Mic array)

1 × dual-channel digital audio codec (16-bit DAC)

1 × VAD

PCIE

2 × PCIe2.0

SATA

2 × SATA3.0

USB

3 × USB3.0、2 × USB2.0 Host 1 × USB2.0 OTG

Power

4V (voltage deviation±5%)

Other Interfaces

9 × I2C、10 × UART、5 × SPI、12 × ADC 、3 × CAN、16 × PWM 、

1 × SDMMC、Multiple GPIO

OS/Software
OS

Android:Android 12.0

Linux :Ubuntu Desktop, Ubuntu Server, Debian11, Buildroot, RTLinux 

Kylin Linux, UOS, etc.

*Support UEFI Boot

General
Size

69.6mm × 49.3mm

Weight

≈50g (no peripheral devices)

Interface Type

SODIMM (260 PIN, 0.5mm pitch)

Heat Dissipation

cooling fan (Click to view)

Power Consumption

Typical: ≈1.6W(4.0V/400mA)

Max: ≈12W(4.0V/3A)

Environment

Operating Temperature: -20℃~60℃

Storage Temperature: -20℃~70℃

Storage Humidity: -40%~70 %