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CT36L/CT36B
Powered by Rockchip RK3588S new-gen 8-core 64-bit processor, the
core board can be configured with up to 32GB RAM. Capable of 8K
video encoding and decoding, it provides abundant interfaces,
supporting multiple hard disks, Gigabit Ethernet and dual-band WiFi6.
It also supports various operating systems. Backplane reference
design is provided for users to make further customization.
RK3588S is Rockchip's new-gen flagship AIoT SoC with 8nm lithography process.
Equipped with 8-core 64-bit CPU, it has frequency
up to 2.4GHz. Integrated with ARM Mali-G610 MP4 quad-core GPU and built-in AI accelerator NPU, it provides
6Tops computing
power and supports mainstream deep learning frameworks. The powerful RK3588S can deliver more optimized
performance
in various AI application scenarios.
The core board supports 8K@60fps H.265/VP9 video decoding and 8K@30fps
H.265/H.264 video encoding, and also
supports encoding and decoding simultaneously — up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps
encoding can be achieved. The strong video encoding and decoding capability makes 8K HD display and delicate
picture
quality available.
Up to 32GB of super-large RAM can be configured, which exceeds the limit of the
previous RAM and delivers a faster response speed.
It can meet the application requirements of products with large RAM and large storage.
It supports HDMI 2.1 (8K), DP1.4 (8K), and dual MIPI-DSI multi-channel video output — up to four-screen output with different displays can be achieved. Dual MIPI-CSI camera input is also supported.
Integrated with PCIe/GMAC/SDIO3.0/USB3.0, it can be extended to Gigabit Ethernet,
WiFi 6/Bluetooth, 5G/4G LTE,
enabling network communication have a higher speed.
PCIe2.1 and SATA3.0 interfaces can be connected with multiple SSD/HDD mass
storage devices at the same
time, making it a reality that the device can be easily expanded with TB storage
capacity.
SATA3.0, PCIe2.1, I2S, I2C, CAN, UART, SPDIF, SDIO3.0, MIPI-CSI, MIPI-DSI, USB3.0, USB2.0, SPI and GPIO are configured.
The core board with 260Pin standard SODIMM interface, which is small in size. It
can be combined with a backplane to form a
complete high-performance mainboard with richer expansion interfaces. So it can be directly applied to
various smart products to
accelerate their development.
Backplane reference design and complete technical
information are provided, so users can efficiently proceed with secondary
development to quickly create independent and controllable products.
Android 12.0, Ubuntu Desktop version and Server version, Debian11, Buildroot,
Kylin and UOS are supported. It supports RTLinux,
delivering excellent real-time performance. UEFI Boot is
also available. The reliable operation provides a safe and stable system
environment for product research and production.
SDK, tutorials, tech docs and development tools are provided, making development simpler and more convenient.
The core board can be widely used in edge computing,
Artificial Intelligence, cloud computing, VR/AR, blockchain,
smart security, smart home, intelligent retail
and smart industry.
Basic Specifications | |
SOC |
RockChip RK3588S |
CPU |
8-core 64-bit (4×Cortex-A76+4×Cortex-A55), 8nm lithography process, frequency up to 2.4GHz |
GPU |
ARM Mali-G610 MP4 quad-core GPU Support OpenGL ES3.2 / OpenCL 2.2 / Vulkan1.1, 450 GFLOPS |
NPU |
NPU computing power up to 6 TOPS, Support INT4/INT8/INT16 mixed operation, Support framework switching of TensorFlow / MXNet / PyTorch / Caffe |
ISP |
Integrated 48MP ISP with HDR&3DNR Integrated 48MP ISP with HDR&3DNR |
VPU |
Video decoding: 8K@60fps H.265/VP9/AVS2 8K@30fps H.264 AVC/MVC 4K@60fps AV1 1080P@60fps MPEG-2/-1/VC-1/VP8 Video encoding: 8K@30fps encoding, support H.265 / H.264 *Achieve up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps encoding |
RAM |
4GB/8GB/16GB 64bit LPDDR4/LPDDR4x/LPDDR5 (Up to 32GB optional) |
Storage |
16GB/32GB/64GB/128GB eMMC |
Hardware Specifications | |
Network |
Integrated GMAC/SDIO3.0/USB3.0 interface, can be expanded with GbE, WiFi6/Bluetooth and 5G/4G LTE |
Video Output |
1 × HDMI2.1 (8K@60fps or 4K@120fps) 2 × MIPI-DSI (4K@60fps) 1 × DP1.4 (8K@30fps) 2 × eDP1.3 (4K@60Hz) 1 × BT.1120 (1080@60fps) * Up to four-screen output with different displays can be achieved. |
Video Input |
2 × MIPI DC (4 Lane DPHY v2.0 or 3 Lane CPHY V1.1) 1 × MIPI CSI (4 Lane) or 2×MIPI CSI (2 Lane) 1 × DVP camera interface (up to 150MHz data input ) |
Audio |
2 × 8 Lane I2S 2 × 2 Lane I2S 2 × SPDIF 2 × 8 Lane PDM (support multi-Mic array) 1 × dual-channel digital audio codec (16-bit DAC) 1 × VAD |
PCIE |
2 × PCIe2.0 |
SATA |
2 × SATA3.0 |
USB |
3 × USB3.0、2 × USB2.0 Host 1 × USB2.0 OTG |
Power |
4V (voltage deviation±5%) |
Other Interfaces |
9 × I2C、10 × UART、5 × SPI、12 × ADC 、3 × CAN、16 × PWM 、 1 × SDMMC、Multiple GPIO |
OS/Software | |
OS |
Android:Android 12.0 Linux :Ubuntu Desktop, Ubuntu Server, Debian11, Buildroot, RTLinux Kylin Linux, UOS, etc. *Support UEFI Boot |
General | |
Size |
69.6mm × 49.3mm |
Weight |
≈50g (no peripheral devices) |
Interface Type |
SODIMM (260 PIN, 0.5mm pitch) |
Heat Dissipation |
cooling fan (Click to view) |
Power Consumption |
Typical: ≈1.6W(4.0V/400mA) Max: ≈12W(4.0V/3A) |
Environment |
Operating Temperature: -20℃~60℃ Storage Temperature: -20℃~70℃ Operating humidity: 10%~90% (non-condensing) |
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