Core-1109-JD4 High-Performance AI Vision Core Board
Equipped with dual-core AI vision processor, integrated AI neural network acceleration NPU, the core board has powerful AI computing performance which can efficiently respond to the detection speed. Supporting multi-channel video encoding and decoding, the board has various interface. It can be flexibly applied to face recognition, gesture recognition, gate access control and other fields.
Dual-core AI vision processor
Low-consumption AI vision processor RV1109, with 14nm lithography process and dual-core 32-bit ARM Cortex-A7 architecture, integrates NEON and FPU — the frequency is up to 1.5GHz. It supports FastBoot, TrustZone technology and multiple crypto engines.
Various AI frameworks
Built-in neural network processor NPU with computing power up to 1.2 Tops realizes that the power consumption of AI computing is less than 10% of the power required by the GPU. With tools and supporting AI algorithms provided, it supports direct conversion and deployment of Tensorflow, PyTorch, Caffe, MxNet, DarkNet, ONNX, etc.
Multi-level image noise reduction
With multi-level image noise reduction, 3F-HDR and other technologies, RV1109
not only ensures the dynamic range of the scene, but also meets the needs of outputting full color in darkness, making "clearly visible" a reality — more conforms to the actual demands in the security field.
2K H.265 encoding & decoding
Built-in Video CODEC supports 2K H.254/H.265@30FPS and multi-channel video encoding and decoding, meeting the needs of low bit rate, low-latency encoding, perceptual encoding and making the video occupancy smaller.
Exquisite and mini
Core board pins are made with gold plating technology, which is anti-corrosion. The size is only 69.6mm x 33.9mm, saving a lot of space.
Stable and reliable OS
It supports Buildroot+QT OS — occupies small space, starts fast, and provides stable and reliable operation.
Various interfaces
SODIMM 260P port is provided; I2C, SPI, UART, ADC, PWM, GPIO, USB2.0, SDIO, I2S, MIPI-DSI, MIPI-CSI, CIF, SDMMC, PHY and other interfaces are equipped, meeting needs of more usage scenarios.
To form high-performance mainboard
The core board can be combined with the backplane to form a complete high-performance industrial mainboard with more expansion interfaces and more powerful performance, which can be directly applied to various smart products to accelerate the product development process.
Abundant resources for customization
A complete SDK, including cross compiler toolchain, BSP source code, application development environment, development documents, examples, face recognition algorithms and other resources, is provided for the users to make a further customization.
