AIO-3399J

Six-Core 64-Bit

all in one industrial main board

Using RK3399 Six-Core ( A72x2+A53x4 ) 64-Bit CPU, up to 2.0Ghz , integrated Quad-Core Mali-T864 GPU. Onboard M.2 PCIe, 4G LTE interface, multiple display interface and serial port. Support the Android/Linux/Ubuntu system and open source code for the second development. It can be quickly applied to a variety of industries.

A New Generation
of Six-Core 64-Bit Processor
AIO-3399J uses the newest ARM Cortex-A72 architecture, six core 64 bit CPU,.The frequency up to 2.0GHz. Compared with Cortex-A57, the processing performance is 100%, The speed is faster, and the performance is stronger.
Compatible with All Mainstream Display
Support LVDS/eDP/MIPI/HDMI interface, Support 5-100 inch displays, can drive the mainstream display screen.
Precise and Reliable Process
4mil immersion gold process, core board finger anti-corrosion, 7x24 hours stable working ,4 stud fixed, solid and reliable

Rich Interface

AIO-3399J has almost all the functions Pin of chip, and the data transmission and extension performance are best.

Open Source

Supporting the source code, tutorials, technical information and development tools can be downloaded from the website, development, learning, industry applications become more simple and convenient.

Widely Used

AIO-3399J can be applied to products of various industries

Specification

Specification
Soc

Rockchip RK3399 ( 28nm HKMG Process )

CPU

Six-Core ARM 64-bit processor, up to 2.0GHz

Based on Big.Little architecture, Dual-Core Cortex-A72 and Quad-Core

Cortex-A53 with separate NEON coprocessor

GPU

ARM Mali-T860 MP4 Quad-Core GPU

Support OpenGL ES1.1/2.0/3.0/3.1, OpenCL and DirectX 11

Support AFBC

VPU

Support 4K VP9 and 4K 10bits H265/H264 video decoding, up to 60fps

1080P multi-format video decoding (WMV, mpeg-1/2/4, VP8)

1080P video encoding, which supports h.264, VP8 format

Video post-processor: anti-cross, de-noising, edge/detail/color optimization

PMU RK808 Power management unit
RAM Dual-Channel DDR3 - 1333MHz ( 1GB/2GB/4GB Optional )
Storage

High-Speed eMMC 5.1 ( 8GB/16GB/32GB/128GB Optional )

MicroSD (TF) Card Slot

PCIE M.2 NGFF ( M-KEY ) , for extend NVMe SSD

Hardware Features
Wireless

Onboard WiFi/Bluetooth Combo Module :

- WiFi 2.4GHz/5GHz Dual-Frequency ( Support 802.11a/b/g/n/ac protocol, 2x2 MIMO )

- Bluetooth 4.1 ( Support BLE )

Onboard 3G/4G LTE (Mini-PCIe ) Module ( Ooptional ) :

- Support WCDMA, EVDO, 4G full netcom

Ethernet

10/100/1000Mbps Ethernet ( Realtek RTL8211E )

Display

Video Output Interface:

- 1 x HDMI 2.0,up to 4K@60fps , support HDCP 1.4/2.2

- 1 x HDMI-IN,support 1080P@60fps input

Screen Interface(Support dual display):

- 1 x Dual-Channel MIPI-DSI,up to 2560x1600@60fps

- 1 x Dual-Channel LVDS,support 1920x1200(24bit)@60fps

- 1 x eDP 1.3 ( 4 lanes with 10.8Gbps )

Audio

1 x HDMI and 1 x DP ( DispalyPort ), audio output

1 x MIC audio input

1 x Analog audio (via 3.5mm Combo Audio Jack for audio input and ouput)

1 x Line-in for audio input

1 x Line-out (socket) for audio output

1 x SPDIF interface for audio output

1 x Double -Speakers, (support left and right output, built-in double 4Ω/2.7W, 8Ω/1.6W PA )

1 x I2S, supports 8 channels

Camera

2 x MIPI-CSI Camera interface, ( built-in Dual-ISP, Maximum 13Mpixel or dual 8Mpixel )

1 x DVP Camera interface, (Maximum 5Mpixel )

PCIe

1 x Mini PCIe,for LTE 4G

1 x PCIe M.2(M-Key),for extend NVMe SSD

SIM 1 x SIM Slot,for Mini-PCIe 4G LTE module
USB 1 x USB2.0 HOST,2 x USB3.0 HOST,6 x USB2.0 Socket
Serial 1 x RS232 ,2 x TTL Serial,1 x RS485
IR 1 x IR Receiver,support remote control
RTC 1 x RTC,Onboard battery socket(supports rtc wake up)
Key 1 x Reset Key,1 x Recover Key
Debugging 1 x Serial Console,for debugging
Other SPI、I2C、ADC、GPIO、Key,and power input and output interface
Power DC12V - 2A ( via DC 5.5*2.1mm Jack or 2.54mm Socket )
OS/Software
OS Android 7.1、Android 6.0、Ubuntu 16.04、u-boot
Programming support C、C++、Kotlin、Java、Shell、Pyhon etc.
Upgrade Support TF-Card upgrade, USB upgrade
Appearance
Size 182.8mm x 107.1mm
High Limit 19mm(Top),2.5mm(Bottom)
Screw Hole Φ 3mm
PCB Parameters Motherboard (4-layer design), Core Board (8-layer design), 1.6mm (thickness), Immersion Gold Technology